Design of High Frequency Ultrasonic Transducers with Flexure Decoupling Flanges for Thermosonic Bonding
- Submitting institution
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The University of Warwick
- Unit of assessment
- 12 - Engineering
- Output identifier
- 9245
- Type
- D - Journal article
- DOI
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10.1109/TIE.2015.2500197
- Title of journal
- IEEE Transactions on Industrial Electronics
- Article number
- -
- First page
- 2304
- Volume
- 63
- Issue
- 4
- ISSN
- 0278-0046
- Open access status
- Out of scope for open access requirements
- Month of publication
- April
- Year of publication
- 2016
- URL
-
-
- Supplementary information
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-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
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5
- Research group(s)
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-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- A novel design methodology for isolating ultrasonic transducers from their support structure is presented, with applications in micro/nano device thermosonic bonding. A prototype transducer is proposed, which has led to a patent (ZL 2015 10683370.4). The output is a result of a UK-China collaboration and is published in the premier journal in its field (IF=7.5). The output was important in securing an NSFC grant (no. 51675376, CNY 0.62 m) on ultrasonic-assisted micro transfer printing, and EU H2020 MSCA grants (NanoScan, and IDeCAST, EUR 0.55 m) on ultrasonic stage design and motion control.
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -