Numerical and theoretical analysis of stochastic electromagnetic fields coupling to a printed circuit board trace
- Submitting institution
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University of York
- Unit of assessment
- 12 - Engineering
- Output identifier
- 66222513
- Type
- D - Journal article
- DOI
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10.1109/TEMC.2019.2954303
- Title of journal
- IEEE Transactions on Electromagnetic Compatibility
- Article number
- -
- First page
- 1128
- Volume
- 62
- Issue
- 4
- ISSN
- 0018-9375
- Open access status
- Compliant
- Month of publication
- December
- Year of publication
- 2019
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
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3
- Research group(s)
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A - Communication Technologies
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- In collaboration with Northwest Institute of Nuclear Technology, Shaanxi, China (Contact: NINT Senior Engineer), this presents models to predict coupling of Electromagnetic Interference (EMI) energy into circuit board components, at high frequencies. In contrast to full-scale modelling which takes days our approach gives results in minutes. It forms an important part of the strategy to allow risk of failure due to EMI to be estimated early in the design stage when coupled with emerging integrated circuit electromagnetic compatibility standards (BS EN 62132-4:2006) and is being further developed in the H2020 project (812790-PETER-H2020-MSCA-ITN-2018) to provide failure predictions
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -