Impact of underfill and other physical dimensions on Silicon Lateral IGBT package reliability using computer model with discrete and continuous design variables
- Submitting institution
-
University of Greenwich
- Unit of assessment
- 12 - Engineering
- Output identifier
- 4123
- Type
- D - Journal article
- DOI
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10.1016/j.microrel.2018.02.024
- Title of journal
- Microelectronics Reliability
- Article number
- -
- First page
- 146
- Volume
- 83
- Issue
- UNSPECIFIED
- ISSN
- 0026-2714
- Open access status
- Compliant
- Month of publication
- -
- Year of publication
- 2018
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
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6
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- Joint university project funded by EPSRC (EP/K034804/1). The paper is significant, as this is the first time that such electro-thermal-mechanical analysis had been undertaken on underfills used for high voltage LED lighting applications. The work led to an invited keynote paper at the IEEE Pan Pacific Conference, and the results from the modelling study is being used to develop new underfills for packaging of these power semiconductor chips.
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -
