Design, manufacture and test for reliable 3D printed electronics packaging
- Submitting institution
-
University of Greenwich
- Unit of assessment
- 12 - Engineering
- Output identifier
- 20182
- Type
- D - Journal article
- DOI
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10.1016/j.microrel.2018.04.008
- Title of journal
- Microelectronics Reliability
- Article number
- -
- First page
- 109
- Volume
- 85
- Issue
- UNSPECIFIED
- ISSN
- 0026-2714
- Open access status
- Compliant
- Month of publication
- -
- Year of publication
- 2018
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
-
6
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- The research was supported by 4.5 Million Euro funding (NextFactory) with a consortia of academic and industrial partners. The work received the best paper prize at the Fraunhofer Digital Direct Manufacturing (DDMC) conference in Berlin in 2016 and led on to a Keynote Presentation at an IEEE Electronics conference in Japan. The research aided adoption of additive manufacturing technologies by consortium member Microchip Technology Inc. (contact Tracy Wotherspoon, Technical Staff Engineer, Tracy.Wotherspoon@microchip.com) and continued commercialisation/development by Fraunhofer IPA and Unitechnologies S.A.
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -
