Removing epoxy underfill between neighbouring components using acid for component chip-off
- Submitting institution
-
University of Aberdeen
- Unit of assessment
- 11 - Computer Science and Informatics
- Output identifier
- 171451210
- Type
- D - Journal article
- DOI
-
10.1016/j.diin.2019.04.003
- Title of journal
- Digital Investigation
- Article number
- -
- First page
- 198
- Volume
- 29
- Issue
- -
- ISSN
- 1742-2876
- Open access status
- Technical exception
- Month of publication
- April
- Year of publication
- 2019
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- Yes
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
-
4
- Research group(s)
-
-
- Citation count
- 0
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- This the first paper to successful decouple iPhone and Blackberry chips using the “underfill acid corrosion” method. The paper provides a quantitative evaluation of the influencing factors on the efficiency of acid corrosions on industrial underfill and these results are pivotal for digital forensic science especially related to smartphone forensics. It also provided a framework for forensics investigators to securely remove chips off iPhone and Blackberry for further investigations. As a result of the published research, the first author received the European Emerging Forensic Scientist Award from the European Network of Forensic Science Institutes in 2018 (https://rb.gy/r951iw).
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -
