Copper electroplating of PCB interconnects using megasonic acoustic streaming
- Submitting institution
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University of Dundee
- Unit of assessment
- 12 - Engineering
- Output identifier
- 48812792
- Type
- D - Journal article
- DOI
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10.1016/j.ultsonch.2017.12.004
- Title of journal
- Ultrasonics Sonochemistry
- Article number
- -
- First page
- 434
- Volume
- 42
- Issue
- -
- ISSN
- 1350-4177
- Open access status
- Compliant
- Month of publication
- December
- Year of publication
- 2017
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
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5
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- This is a paper demonstrating enhancements to Printed Circuit Board manufacturing technique in the order of 50 %. The work was further optimised in publication Ultrasonics. (2020) 106111. doi:https://doi.org/10.1016/j.ultras.2020.106111. It was also disseminated at academic conference (Symp. Des. Test, Integr. Packag. MEMS/MOEMS, 2016. doi:10.1109/dtip.2016.7514855.), and also industrial trade fare (2015, Defence & Security Equipment International [DSEI] - the world’s largest arms fair), to research experts and industrialists. This research was financially supported by Merlin Circuit Technology Ltd, UK.
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -