Heterogeneous integration of contact-printed semiconductor nanowires for high-performance devices on large areas
- Submitting institution
-
University of the West of Scotland
- Unit of assessment
- 12 - Engineering
- Output identifier
- 21701742
- Type
- D - Journal article
- DOI
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10.1038/s41378-018-0021-6
- Title of journal
- Microsystems & Nanoengineering
- Article number
- 22
- First page
- -
- Volume
- 4
- Issue
- -
- ISSN
- 2055-7434
- Open access status
- Compliant
- Month of publication
- August
- Year of publication
- 2018
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
-
5
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- Future electronics demands new ways for integration of low-power miniaturized devices over large areas and flexible substrates such as plastic, paper, fabrics, etc. This work is significant, because it develops a contact-printing system to efficiently transfer the bottom-up and top-down semiconductor nanowires (NWs), preserving their as-grown features with a good control over their electronic properties. The paper highlights contact-printing system for the fabrication of ZnO and Si NW-based ultraviolet (UV) photodetectors (PDs) with Wheatstone bridge (WB) configuration on rigid and flexible substrates.
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -