A computational investigation of the effect of three-dimensional void morphology on the thermal resistance of solder thermal interface materials
- Submitting institution
-
University of Greenwich
- Unit of assessment
- 12 - Engineering
- Output identifier
- 20566
- Type
- D - Journal article
- DOI
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10.1016/j.applthermaleng.2018.07.002
- Title of journal
- Applied Thermal Engineering
- Article number
- -
- First page
- 346
- Volume
- 142
- Issue
- UNSPECIFIED
- ISSN
- 1359-4311
- Open access status
- Compliant
- Month of publication
- -
- Year of publication
- 2018
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
-
1
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- This paper reported on the use of computational methods to assess the effect of voids on thermal performance of microchips. It was the first attempt in realistic representation of voids with spherical and randomly distributed morphologies. The research led to the award of £75,000 European Union Regional Development Fund‚ Knowledge Exchange Embed Partnership Grant (grant number: 062) with a local SME. The output informed the optimization of the production processes involving thermal management of their production processes. The work with the company led to a £1.46 million turn-over for the organization.
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -
