Liquid Metal Magnetohydrodynamic Pump for Junction Temperature Control of Power Modules
- Submitting institution
-
The University of Leicester
- Unit of assessment
- 12 - Engineering
- Output identifier
- 1523
- Type
- D - Journal article
- DOI
-
10.1109/TPEL.2018.2806622
- Title of journal
- IEEE Transactions on Power Electronics
- Article number
- -
- First page
- 10583
- Volume
- 33
- Issue
- 12
- ISSN
- 0885-8993
- Open access status
- Compliant
- Month of publication
- February
- Year of publication
- 2018
- URL
-
-
- Supplementary information
-
https://doi.org/10.1109/TPEL.2018.2806622
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
-
0
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- The authors have devised a completely novel cooling element for power modules. This paper is significant in supporting transportation electrification by improving reliability and power density of power electronic converters, showing for the first time how a liquid metal based magneto-hydrodynamic pump can be used for power semiconductor cooling and enable advanced active cooling algorithm by accounting for the field use conditions. With a comparison to the conventional water passive cooling, the intensity of temperature cycling and the peak temperature can both be largely reduced offering field longevity as well as a smaller form factor for power switching units.
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -