Numerical analysis on thermal crack initiation due to non-homogeneous solder coating on the round strip interconnection of photo-voltaic modules
- Submitting institution
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University of Wolverhampton
- Unit of assessment
- 12 - Engineering
- Output identifier
- 1659
- Type
- D - Journal article
- DOI
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10.1016/j.solener.2019.10.092
- Title of journal
- Solar Energy
- Article number
- -
- First page
- 649
- Volume
- 194
- Issue
- -
- ISSN
- 0038-092X
- Open access status
- Compliant
- Month of publication
- November
- Year of publication
- 2019
- URL
-
-
- Supplementary information
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-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
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1
- Research group(s)
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-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- Multi-Busbar is a new type of interconnection that incorporates several round copper wires to help increase the energy conversion and transmission efficiency of PV modules and helps reduce material costs. The study shows that the cracking temperature is mostly affected by the downward vertical direction of copper out-of-centre positioning in the solder-coating (decreases by ≈21%). The novel XFEM methodology developed for analysing IMC in PV module solder interconnections is used in a follow-up study (https://doi.org/10.1016/j.solener.2020.06.036). This work has been used extensively by other researchers researchers (http://doi.one/10.1729/Journal.25159, https://doi.org/10.1016/j.engfailanal.2021.105309; https://doi.org/10.1108/SSMT-10-2020-0045; https://doi.org/10.1007/S10854-020-04688-7).
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -
