Investigation into how the floor plan layout of a manufactured PCB influences flip-chip susceptibility to vibration
- Submitting institution
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Liverpool John Moores University
- Unit of assessment
- 12 - Engineering
- Output identifier
- 1453
- Type
- D - Journal article
- DOI
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10.1109/TCPMT.2020.2987334
- Title of journal
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Article number
- -
- First page
- 741
- Volume
- 10
- Issue
- 5
- ISSN
- 2156-3950
- Open access status
- Compliant
- Month of publication
- April
- Year of publication
- 2020
- URL
-
-
- Supplementary information
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-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
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3
- Research group(s)
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C - GERI
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- Accelerated lifetime tests using random vibration profiles from an automotive environment uncovered practical details about the most reliable positions of flip-chips and their relative positions for chips populated on both sides of a PCB. The technology has been taken up by industry for validation of real automotive electronics systems through industrial collaboration (Derek Braden, Aptiv, d.braden@aptiv.com) and to inform acoustic measurements (R. Carr, Technical Director of Sonoscan (Europe) Ltd, rcarr@sonoscan.com). This research led to a Newton Fund grant on green electronics/solder joints with UniMAP in Malaysia (£150k, 2018-2020), and the EU H2020 RISE Project ReACTIVE (€800k, 2020-2024).
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -