Electrical and mechanical analysis of different TSV geometries
- Submitting institution
-
University of Wolverhampton
- Unit of assessment
- 12 - Engineering
- Output identifier
- 1661
- Type
- D - Journal article
- DOI
-
10.3390/met10040467
- Title of journal
- Metals
- Article number
- ARTN 467
- First page
- 467
- Volume
- 10
- Issue
- 4
- ISSN
- 2075-4701
- Open access status
- Compliant
- Month of publication
- April
- Year of publication
- 2020
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
-
3
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- This is one of the first reported studies on the impact of TSV bump geometry on TSV electrical and mechanical characteristics. Signal degradation due to crosstalk, switching noise, and the protrusion of Cu are the major reliability issues associated with TSV fabrication/manufacturing processes. The study shows that the quadrangular shape had the best electrical performance, whilst quadrangular and cylindrical shapes provided improved mechanical reliability after the annealing process. These findings are significant because they show how TSV bump geometry contributes to improving characteristic impedance and the mechanical reliability for different multilayer TSVs and TSV designers/manufacturers are the immediate beneficiaries.
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -