A multiphysics modeling and experimental analysis of pressure contacts in power electronics applications
- Submitting institution
-
University of Greenwich
- Unit of assessment
- 12 - Engineering
- Output identifier
- 17113
- Type
- D - Journal article
- DOI
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10.1109/TCPMT.2017.2688021
- Title of journal
- IEEE Transactions on Components, Packaging and Manufacturing Technology
- Article number
- -
- First page
- 893
- Volume
- 7
- Issue
- 6
- ISSN
- 2156-3950
- Open access status
- Compliant
- Month of publication
- -
- Year of publication
- 2017
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
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4
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- Funded through the EPSRC Centre for Power Electronics (EP/K034804/1). Press-pack materials have the potential to replace bonded interconnects, and hence could resolve several challenges for high-reliability applications. The paper is significant as this is the first time a validated multi-domain (electrical, thermal, mechanical) modelling methodology, including contact conditions, has been reported for this type of package. Contributed to Professor Bailey invitation to lead the modelling and simulation activities for the IEEE Heterogeneous Integration Roadmap (http://cpmt.ieee.org/technology/heterogeneous-integration-roadmap.html), contact (Bill Chen, ASE, william.chen@aseus.com).
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -
