A new method for liquid-phase bonding of copper plates to aluminum nitride (AlN) substrates used in high-power modules
- Submitting institution
-
The Open University
- Unit of assessment
- 12 - Engineering
- Output identifier
- 1458574
- Type
- D - Journal article
- DOI
-
10.1007/s10854-019-00961-6
- Title of journal
- Journal of Materials Science: Materials in Electronics
- Article number
- -
- First page
- 6552
- Volume
- 30
- Issue
- 7
- ISSN
- 0957-4522
- Open access status
- Compliant
- Month of publication
- February
- Year of publication
- 2019
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
-
4
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- The project was in collaboration with Mitsubishi Materials (Japan) and resulted in the development of a novel bonding process with vast potential applications in fabrication of the electronic modules used in electric cars and trains (being patented by Mitsubishi). The innovate process relies on 3-D printing of silver and titanium powders (as brazing media) on a copper substrate to facilitates bonding the copper to an insulating ceramic substrate (Aluminium Nitride) at low temperatures. The first author from Mitsubishi will reside in the UK for 12 months in order to continue the joint work. https://doi.org/10.1007/s10854-019-00961-6
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -
