A thermal cycling reliability study of ultrasonically bonded copper wires
- Submitting institution
-
University of Nottingham, The
- Unit of assessment
- 12 - Engineering
- Output identifier
- 1321421
- Type
- D - Journal article
- DOI
-
10.1016/j.microrel.2016.01.009
- Title of journal
- Microelectronics Reliability
- Article number
- -
- First page
- 126
- Volume
- 59
- Issue
- -
- ISSN
- 0026-2714
- Open access status
- Out of scope for open access requirements
- Month of publication
- January
- Year of publication
- 2016
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
-
5
- Research group(s)
-
T - Power Electronics Machines & Control
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- This research into the reliability of copper interconnects formed the basis of a successful multi-institutional EPSRC project (EP/R004366/1, value GBP411K) and supported a Knowledge Transfer Partnership application (Innovate UK, KTP11574, value GBP104K ) in collaboration with Littelfuse Group.
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -
