Electromigration in Sn-Ag solder thin films under high current density
- Submitting institution
-
University of Greenwich
- Unit of assessment
- 12 - Engineering
- Output identifier
- 12050
- Type
- D - Journal article
- DOI
-
10.1016/j.tsf.2014.06.030
- Title of journal
- Thin Solid Films
- Article number
- -
- First page
- 193
- Volume
- 565
- Issue
- UNSPECIFIED
- ISSN
- 0040-6090
- Open access status
- Out of scope for open access requirements
- Month of publication
- -
- Year of publication
- 2014
- URL
-
-
- Supplementary information
-
-
- Request cross-referral to
- -
- Output has been delayed by COVID-19
- No
- COVID-19 affected output statement
- -
- Forensic science
- No
- Criminology
- No
- Interdisciplinary
- No
- Number of additional authors
-
6
- Research group(s)
-
-
- Proposed double-weighted
- No
- Reserve for an output with double weighting
- No
- Additional information
- Joint work between Kings College, Greenwich, and City University of Hong Kong. Worlds first in applying and validating a multi-physics model for the metal migration issue in small electronic interconnects. The work played a significant role in Greenwich being a key player in the EPSRC Centre for Power Electronics where it is leading the cross-theme activity in design tools and modelling (EP/K034804/1). Contributed to a new funded PhD
- Author contribution statement
- -
- Non-English
- No
- English abstract
- -
